Environmentally controlled coating systems

ABSTRACT

Embodiments of an enclosed coating system according to the present teachings can be useful for patterned area coating of substrates in the manufacture of a variety of apparatuses and devices in a wide range of technology areas, for example, but not limited by, OLED displays, OLED lighting, organic photovoltaics, Perovskite solar cells, and organic semiconductor circuits. Enclosed and environmentally controlled coating systems of the present teachings can provide several advantages, such as: 1) Elimination of a range of vacuum processing operations such coating-based fabrication can be performed at atmospheric pressure. 2) Controlled patterned coating eliminates material waste, as well as eliminating additional processing typically required to achieve patterning of an organic layer. 3) Various formulations used for patterned coating with various embodiments of an enclosed coating apparatus of the present teachings can have a wide range of physical properties, such as viscosity and surface tension. Various embodiments of an enclosed coating system can be integrated with various components that provide a gas circulation and filtration system, a particle control system, a gas purification system, and a thermal regulation system and the like to form various embodiments of an enclosed coating system that can sustain an inert gas environment that is substantially low-particle for various coating processes of the present teachings that require such an environment.

CROSS REFERENCE TO RELATED CASES

This application is a division of U.S. patent application Ser. No.15/485,928, filed on Apr. 12, 2017. U.S. patent application Ser. No.15/485,928 is a continuation of International Application No.PCT/US15/62777, filed Nov. 25, 2015. International Application No.PCT/US15/62777 claims benefit of U.S. Provisional Application62/085,211, filed on Nov. 26, 2014. All applications listed herein arehereby incorporated by reference, each in its entirety.

OVERVIEW

Embodiments of an enclosed coating system according to the presentteachings can be useful for patterned area coating of substrates in themanufacture of a variety of devices and apparatuses in a wide range oftechnology areas, for example, but not limited by, OLED displays, OLEDlighting, organic photovoltaics, Perovskite solar cells, and organicsemiconductor circuits.

For example, by way of a non-limiting example, for RGB OLED displays,though the demonstration of OLED displays for small screen applications,primarily for cell phones, has served to emphasize the potential of thetechnology, challenges remain in scaling high volume manufacturingacross a range of substrate formats in high yield for RGB OLED. Withrespect to scaling of formats for RGB OLED display technology, a Gen 5.5substrate has dimensions of about 130 cm×150 cm and can yield abouteight 26″ flat panel displays. In comparison, larger format substratescan include using Gen 7.5 and Gen 8.5 mother glass active area sizes. AGen 7.5 mother glass has dimensions of about 195 cm×225 cm, and can becut into eight 42″ or six 47″ flat panel displays per substrate. Themother glass used in Gen 8.5 is approximately 220 cm×250 cm, and can becut to six 55″ or eight 46″ flat panel displays per substrate. Oneindication of the challenges that remain in scaling of RGB OLED displaymanufacturing to larger formats is that the high-volume manufacture ofRGB OLED displays in high yield on substrates larger than Gen 5.5substrates has proven to be substantially challenging.

In principle, various materials comprising an RGB OLED stack structurecan be susceptible to damage by oxidation and other chemical processes.Moreover, until the active area containing such RGB OLED materials canbe effectively hermetically sealed, the various materials in an RGB OLEDdevice or apparatus active area are subject to degradation by variousreactive gaseous species, such as, for example, but not limited by,water vapor, oxygen, ozone, organic solvent vapors, and the like.Similar considerations with respect to degradation during processing areapparent in the manufacture of other types of electronic devices, suchas OLED lighting, organic photovoltaics, Perovskite solar cells, andorganic semiconductor circuits. According to the present teachings,various embodiments of an environmentally controlled coating system canbe configured to coat an organic film layer over a variety of electronicdevices.

However, housing a coating system in a fashion that can be scaled forvarious devices and device sizes and can be done in an inert,substantially low-particle process environment can present a variety ofengineering challenges. For example, manufacturing tools for highthroughput large-format substrate coating, for example, substratesequivalent to the coating of Gen 7.5 and Gen 8.5 substrates for variousOLED devices, require substantially large facilities. Accordingly,maintaining a large facility under an inert atmosphere, requiring gaspurification to remove reactive atmospheric species, such as by way ofnon-limiting examples, water vapor, ozone and oxygen, as well as organicsolvent vapors, as well as maintaining a substantially low-particleprocess environment, has proven to be significantly challenging.

As such, challenges remain in scaling high volume coating systems forthe manufacturing of a variety of electronic devices and apparatusesacross a range of device sizes in high yield. Accordingly, there existsa need for various embodiments an environmentally controlled, enclosedcoating system housed in an inert, substantially low-particleenvironment, that can be readily scaled to provide for coating of avariety of electronic devices and apparatuses, which may have a varietyof active area aspect ratios and sizes, as well as a variety of deviceand apparatus materials. Additionally, various enclosed,environmentally-controlled coating systems of the present teachings canprovide for ready access to a coating system from the exterior duringprocessing and ready access to the interior for maintenance with minimaldowntime.

BRIEF DESCRIPTION OF THE DRAWINGS

A better understanding of the features and advantages of the presentdisclosure will be obtained by reference to the accompanying drawings,which are intended to illustrate, not limit, the present teachings.

FIG. 1 is a front perspective view of view of an enclosure assembly fora coating system in accordance with various embodiments of the presentteachings.

FIG. 2A depicts an exploded view of various embodiments of an enclosedcoating system as in an enclosure as depicted in FIG. 1.

FIG. 2B depicts an expanded iso perspective view of the coating systemdepicted in FIG. 2A.

FIG. 2C is an expanded perspective view of a slot die coating apparatusindicated in FIG. 2B.

FIG. 2D is a schematic view of a slot die coating apparatus configuredto provide patterned area coating on a substrate.

FIG. 3A illustrates generally an isometric view of at least a portion ofa system, such as including a coating module and other modules. FIG. 3Billustrates a plan view of the system generally illustrated in FIG. 3A.

FIG. 4 illustrates a technique, such as a method, that can includecoating an organic thin-film on a substrate.

FIG. 5 is a schematic view of various embodiments of an enclosed coatingsystem and related system components the present teachings.

DETAILED DESCRIPTION OF THE DISCLOSURE

The present teachings disclose various embodiments of an enclosedcoating system that can be maintained in an enclosure assembly, whichcan provide a controlled coating environment. Various embodiments of anenclosure assembly can be sealably constructed and integrated withvarious components that provide a gas circulation and filtration system,a particle control system, a gas purification system, and a thermalregulation system and the like to form various embodiments of anenclosed coating system that can sustain an inert gas environment thatis substantially low-particle for various coating processes of thepresent teachings that require such an environment. Various embodimentsof an enclosure assembly can have a coating system enclosure and anauxiliary enclosure constructed as a section of an enclosure assembly,for which the auxiliary enclosure can be sealably isolated from thecoating system enclosure. Embodiments of an enclosed coating systemaccording to the present teachings can be useful for patterned areacoating of substrates in the manufacture of a variety of apparatuses anddevices in a wide range of technology areas, for example, but notlimited by, OLED displays, OLED lighting, organic photovoltaics,Perovskite solar cells, and organic semiconductor circuits.

According to the present teachings, for example, but not limited by, anorganic encapsulation layer can be coated on the active area of variousembodiments of various OLED-based devices and apparatuses usingpatterned coating technology. Embodiments of an enclosed coating systemaccording to the present teachings can be useful for patterned areacoating of substrates in the manufacture of a variety of apparatuses anddevices in a wide range of technology areas, for example, but notlimited by, OLED displays, OLED lighting, organic photovoltaics,Perovskite solar cells, and organic semiconductor circuits. In variousembodiments of environmentally controlled coating systems of the presentteachings, various coating solutions can be coated using slot diecoating, as slot die coating can provide several advantages. First, arange of vacuum processing operations can be eliminated because suchcoating-based fabrication can be performed at atmospheric pressure.Additionally, during a slot die coating process, a coating solution orcoating formulation can be localized to cover targeted portions ofvarious devices and apparatuses to effectively cover such targetedportions of a substrate. Finally, the targeted patterning using coatingresults in eliminating material waste, as well as eliminating additionalprocessing typically required to achieve patterning of an organic layer.

For example, various organic material formulations used for patternedcoating with various embodiments of an enclosed coating apparatus of thepresent teachings can have a wide range of physical properties, such asviscosity and surface tension. An organic material formulation depositedusing an enclosed coating apparatus of the present teachings cancomprise a polymer including, for example, but not limited by, anacrylate, methacrylate, urethane, or other material, as well ascopolymers and mixtures thereof, which can be cured using thermalprocessing (e.g. bake), UV exposure, and combinations thereof. As usedherein polymer and copolymer can include any form of a polymer componentthat can be formulated into a coating solution and cured on a substrateto form a uniform polymeric layer. Such polymeric components can includepolymers, and copolymers, as well as precursors thereof, for example,but not limited by, monomers, oligomers, and resins.

An enclosed coating apparatus, such as coating apparatus 2000 of FIG.2A, shown in expanded view in FIG. 2B, can be comprised of severaldevices and apparatuses, which allow the reliable coating of a coatingsolution onto specific locations of substrate active areas for variousOLED-based devices and apparatuses. Coating requires relative motionbetween the coating assembly and the device or apparatus substrate. Thiscan be accomplished with a motion system, typically a gantry or splitaxis XYZ system. Either the coating assembly can move over a stationarysubstrate (gantry style), or both the coating assembly and substrate canmove, in the case of a split axis configuration. In another embodiment,a coating assembly can be substantially stationary; for example, in theX and Y axes, and the substrate can move in the X and Y axes relative toa coating die assembly, with Z axis motion provided either by asubstrate support apparatus or by a Z-axis motion system associated witha coating assembly. A substrate can be inserted and removed from thecoating apparatus using a substrate loading and unloading system.Depending on the coating apparatus configuration, this can beaccomplished with a mechanical conveyor, a substrate floatation tablewith a conveyance assembly, or a substrate transfer robot with endeffector. For various embodiments of systems and methods of the presentteachings, an Y-axis motion system can be based on an air-bearinggripper system.

Manufacturing tools that in principle can allow for the coating of avariety of device active area sizes; including large-format active areasizes, can require substantially large facilities for housing suchmanufacturing tools. Accordingly, maintaining an entire large facilityunder an inert atmosphere presents engineering challenges, such ascontinual purification of a large volume of an inert gas. Variousembodiments of an enclosed coating system can have a circulation andfiltration system internal an enclosure assembly in conjunction with agas purification system external a gas enclosure that together canprovide continuous circulation of a substantially low-particulate inertgas having substantially low levels of reactive species throughout anenclosed coating system. According to the present teachings, an inertgas may be any gas that does not undergo a chemical reaction under adefined set of process conditions. Some commonly used non-limitingexamples of an inert gas can include nitrogen, any of the noble gases,and any combination thereof. Additionally, providing a large facilitythat is essentially hermetically sealed to prevent contamination ofvarious reactive atmospheric gases, such as water vapor, oxygen, andozone, as well as, for example, organic solvent vapors generated fromvarious coating solutions, poses an engineering challenge. According tothe present teachings, a coating facility would maintain levels for eachspecies of various reactive species, including various reactiveatmospheric gases, such as water vapor, oxygen, and ozone, as well asorganic solvent vapors at 100 ppm or lower, for example, at 10 ppm orlower, at 1.0 ppm or lower, or at 0.1 ppm or lower.

By way of a non-limiting example meant to illustrate the need formaintaining levels of reactive species in the manufacture of variouselectronic devices, the information presented in Table I is illustrativeof the sensitivity of various OLED emissive materials to environmentalconditions. The data summarized on Table 1 resulted from the testing ofeach of a test coupon comprising organic thin film compositions for eachof red, green, and blue, fabricated in a large-pixel, spin-coated deviceformat. Such test coupons are substantially easier to fabricate and testfor the purpose of rapid evaluation of various formulations andprocesses of various OLED devices. Though test coupon testing should notbe confused with lifetime testing of a fabricated OLED device, it can beindicative of the impact of various formulations and processes onlifetime. The results shown in the table below represent variation inthe process step in the fabrication of test coupons in which only thespin-coating environment varied for test coupons fabricated in anitrogen environment where reactive species were less than 1 ppmcompared to test coupons similarly fabricated but in air instead of anitrogen environment.

It is evident through the inspection of the data in Table 1 for testcoupons fabricated under different processing environments, particularlyin the case of red and blue, that fabrication of an OLED device in anenvironment that effectively reduces exposure of various organic thinfilm compositions to reactive species may have a substantial impact onthe stability of various OLED materials, and hence on device lifetime.The lifetime specification is of particular significance for variousOLED technologies, as this correlates directly to product longevity;which has been challenging for various OLED-based technologies to meet.In order to meet requisite lifetime specifications, levels of each of areactive species, such as, but not limited by, water vapor, oxygen,ozone, as well as organic solvent vapors, can be maintained at 100 ppmor lower, for example, at 10 ppm or lower, at 1.0 ppm or lower, or at0.1 ppm or lower with various embodiments of an enclosed coating systemof the present teachings. These data emphasize the need for maintainingcontrolled environmental conditions for various OLED devices andapparatuses being fabricated until the hermetic sealing of an OLEDactive area has been achieved.

TABLE 1 Impact of inert gas processing on lifetime for OLED panelsProcess V Cd/A CIE (x, y) T95 T80 T50 Color Environment @ 10 mA/cm² @1000 Cd/m² Red Nitrogen 6 9 (0.61, 0.38) 200 1750 10400 Air 6 8 (0.60,0.39) 30 700 5600 Green Nitrogen 7 66 (0.32, 0.63) 250 3700 32000 Air 761 (0.32, 0.62) 250 2450 19700 Blue Nitrogen 4 5 (0.14, 0.10) 150 7503200 Air 4 5 (0.14, 0.10) 15 250 1800

In addition to providing an inert environment, maintaining asubstantially low-particle environment for OLED-based technologies is ofparticular importance, as even very small particles can lead to avisible defects in an end product. Particle control in an enclosedcoating system can present significant challenges not presented forprocesses that can be done, for example, in atmospheric conditions underopen air, high flow laminar flow filtration hoods. For example, amanufacturing facility can require a substantial length of variousservice bundles that can be operatively connected from various systemsand assemblies to provide optical, electrical, mechanical, and fluidicconnections required to operate, for example, but not limited by, acoating system. Such service bundles used in the operation of a coatingsystem and located proximal to a substrate positioned for coating can bean ongoing source of particulate matter. Additionally, components usedin a coating system, such as fans or linear motion systems that usefriction bearing, can be particle generating components. Variousembodiments of a gas circulation and filtration system in conjunctionwith various embodiments of ductwork of the present teachings can beused to contain and effectively filter particulate matter. Additionally,by using a variety of intrinsically low-particle generatingpneumatically operated components, such as, but not limited by,substrate floatation tables, air bearings, and pneumatically operatedrobots, and the like, a low particle environment for various embodimentsof an enclosed coating system can be maintained. For example, variousembodiments of a gas circulation and filtration system can be designedto provide a low particle inert gas environment for airborneparticulates meeting the standards of International StandardsOrganization Standard (ISO) 14644-1:1999, “Cleanrooms and associatedcontrolled environments—Part 1: Classification of air cleanliness,” asspecified by Class 1 through Class 5. However, controlling airborneparticulate matter alone is not sufficient for providing a low-particleenvironment proximal to a substrate during, for example, but not limitedby, a coating process, as particles generated proximal to a substrateduring such a process can accumulate on a substrate surface before theycan be swept through a gas circulation and filtration system.

With respect to airborne particulate matter and particle depositionwithin a system, a substantial number of variables can impact developinga general model that may adequately compute, for example, anapproximation of a value for particle fallout rate on a surface, such asa substrate, for any particular manufacturing system. Variables such asthe size of particles, the distribution of particles of particular size;surface area of a substrate and the time of exposure of a substratewithin a system can vary depending on various manufacturing systems. Forexample, the size of particles and the distribution of particles ofparticular size can be substantially impacted by the source and locationof particle-generating components in various manufacturing systems.Calculations based on various embodiments of enclosed coating systems ofthe present teachings suggest that without various particle controlsystems of the present teachings, on-substrate deposition of particulatematter per coating cycle per square meter of substrate can be betweenmore than about 1 million to more than about 10 million particles forparticles in a size range of 0.1 μm and greater. Such calculationssuggest that that without various particle control systems of thepresent teachings, on-substrate deposition of particulate matter percoating cycle per square meter of substrate can be between more thanabout 1000 to about more than about 10,000 particles for particles in asize range of about 2 μm and greater.

Various embodiments of a low-particle coating system of the presentteachings can maintain a low-particle environment providing for anaverage on-substrate particle distribution that meets an on-substratedeposition rate specification of less than or equal to about 100particles per square meter of substrate per minute for particles greaterthan or equal to 10 μm in size. Various embodiments of a low-particlecoating system of the present teachings can maintain a low-particleenvironment providing for an average on-substrate particle distributionthat meets an on-substrate deposition rate specification of less than orequal to about 100 particles per square meter of substrate per minutefor particles greater than or equal to 5 μm in size. In variousembodiments of an enclosed coating system of the present teachings, alow-particle environment can be maintained providing for an averageon-substrate particle distribution that meets an on-substrate depositionrate specification of less than or equal to about 100 particles persquare meter of substrate per minute for particles greater than or equalto 2 μm in size. In various embodiments of an enclosed coating system ofthe present teachings, a low-particle environment can be maintainedproviding for an average on-substrate particle distribution that meetsan on-substrate deposition rate specification of less than or equal toabout 100 particles per square meter of substrate per minute forparticles greater than or equal to 1 μm in size. Various embodiments ofa low-particle coating system of the present teachings can maintain alow-particle environment providing for an average on-substrate particledistribution that meets an on-substrate deposition rate specification ofless than or equal to about 1000 particles per square meter of substrateper minute for particles greater than or equal to 0.5 μm in size. Forvarious embodiments of an enclosed coating system of the presentteachings, a low-particle environment can be maintained providing for anaverage on-substrate particle distribution that meets an on-substratedeposition rate specification of less than or equal to about 1000particles per square meter of substrate per minute for particles greaterthan or equal to 0.3 μm in size. Various embodiments of a low-particlecoating system of the present teachings can maintain a low-particleenvironment providing for an average on-substrate particle distributionthat meets an on-substrate deposition rate specification of less than orequal to about 1000 particles per square meter of substrate per minutefor particles greater than or equal to 0.1 μm in size.

Various embodiments of an enclosure assembly can have various framemembers that are constructed to provide contour for an enclosed coatingsystem. Various embodiments of an enclosure assembly of the presentteachings can accommodate a coating system, while optimizing the workingspace to minimize inert gas volume, and also allowing ready access to anenclosed coating system from the exterior during processing. In thatregard, various an enclosure assemblies of the present teachings canhave a contoured topology and volume. As will be discussed in moredetail subsequently herein, various embodiments of a coating systemenclosure can be contoured around a coating system base, upon which asubstrate support apparatus can be mounted. Further, a coating systemenclosure can be contoured around a bridge structure that can be used,for example, for the X-axis movement of a carriage assembly. As anon-limiting example, various embodiments of a contoured coating systemenclosure according to the present teachings can have a volume ofbetween about 6 m³ to about 95 m³ for housing various embodiments of acoating system capable of coating various active area sizescorresponding to, for example, substrates for various OLED-basedtechnologies, for example OLED display device substrates of Gen 3.5 toGen 10 active area sizes. By way a further non-limiting example, variousembodiments of a contoured gas enclosure according to the presentteachings can have a gas enclosure volume of between about 15 m³ toabout 30 m³ for housing various embodiments of a coating system capableof coating, for example, Gen 5.5 to Gen 8.5 active area sizes. Suchembodiments of a contoured gas enclosure can be between about 30% toabout 70% savings in volume in comparison to a non-contoured enclosurehaving non-contoured dimensions for width, length and height.

FIG. 1 depicts a perspective view enclosure assembly 1000 in accordancewith various embodiments of an enclosed coating system of the presentteachings. Enclosure assembly 1000 can include front panel assembly1200′, middle panel assembly 1300′ and rear panel assembly 1400′. Frontpanel assembly 1200′ can include front ceiling panel assembly 1260′,front wall panel assembly 1240′, which can have opening 1242 forreceiving a substrate, and front base panel assembly 1220′. Rear panelassembly 1400′ can include rear ceiling panel assembly 1460′, rear wallpanel assembly 1440′ and rear base panel assembly 1420′. Middle panelassembly 1300′ can include first middle enclosure panel assembly 1340′,middle wall and ceiling panel assembly 1360′ and second middle enclosurepanel assembly 1380′, as well as middle base panel assembly 1320′.

Additionally, as depicted in FIG. 1, middle panel assembly 1300′ caninclude first auxiliary panel assembly, as well as a second auxiliarypanel assembly (not shown). Various embodiments of an auxiliaryenclosure constructed as a section of an enclosure assembly can besealably isolated from the working volume of an enclosed coating system.For various embodiments of systems and methods of the present teachings,an auxiliary enclosure can be less than or equal to about 1% of anenclosure assembly volume. In various embodiments of systems and methodsof the present teachings, an auxiliary enclosure can be can be less thanor equal to about 2% of an enclosure assembly volume. For variousembodiments of systems and methods of the present teachings, anauxiliary enclosure can be less than or equal to about 5% of theenclosure assembly volume. In various embodiments of systems and methodsof the present teachings, an auxiliary enclosure can be less than orequal to about 10% of the enclosure assembly volume. In variousembodiments of systems and methods of the present teachings, anauxiliary enclosure can be less than or equal to about 20% of theenclosure assembly volume. Should the opening of an auxiliary enclosureto an ambient environment containing reactive gases be indicated forperforming, for example, a maintenance procedure, isolating an auxiliaryenclosure from the working volume of a coating system enclosure canprevent contamination of the coating system enclosure. Further, giventhe relatively small volume of an auxiliary enclosure in comparison toan enclosure assembly, the recovery time for an auxiliary enclosure cantake significantly less time than recovery time for an entire enclosureassembly.

As depicted in FIG. 2A, enclosure assembly 1000 can include front basepanel assembly 1220′, middle base panel assembly 1320′, and rear basepanel assembly 1420′, which when fully-constructed form a contiguousbase or pan on which coating apparatus 2000 can be mounted. According tothe present teachings, the various frame members and panels comprisingfront panel assembly 1200′, middle panel assembly 1300′, and rear panelassembly 1400′ of enclosure assembly 1000 can be joined around coatingapparatus 2000 to form a coating system enclosure. Front panel assembly1200′ can be contoured around coating apparatus 2000 mounted to form afirst tunnel section of a gas enclosure. Similarly, rear panel assembly1400′ can be contoured around coating apparatus 2000 to form a secondtunnel section of a gas enclosure. Additionally, middle panel assembly1300′ can be contoured around a coating apparatus 2000 to form a bridgesection of a gas enclosure. A fully constructed enclosure assembly, suchas enclosure assembly 1000, when integrated with various environmentalcontrol systems can form various embodiments of an enclosed coatingsystem including various embodiments of an enclosed coating system, suchas coating apparatus 2000. According to various embodiments of anenclosed coating system of the present teachings, environmental controlof an interior volume defined by an enclosed coating system can includecontrol of lighting, for example, by the number and placement of lightsof a specific wavelength, control of particulate matter using variousembodiments of a particle control system, control of reactive gasspecies using various embodiments of a gas purification system, andtemperature control of an enclosed coating system using variousembodiments of a thermal regulation system.

A coating apparatus, such as coating apparatus 2000 of FIG. 2A, shown inexpanded view in FIG. 2B, can be comprised of several devices,assemblies and subassemblies, which allow the reliable placement of acoating solution or coating formulation onto specific locations onvarious OLED-based device and apparatus substrates. These variousdevices, assemblies, and subassemblies of a coating apparatus caninclude, but are not limited to, a coating assembly, coating solutiondelivery system, a motion system for providing relative motion between acoating assembly and a substrate, substrate support apparatus, substrateloading and unloading system.

For example, for slot die coating, slot die coating assembly 2800,having first side 2801 and second side 2802, of FIG. 2B can be a slotdie coating assembly, capable of depositing a coating solution atcontrolled rate and thickness. Various embodiments of coating assembly2800 can deposit a coating solution as a patterned area coating, forexample, on a plurality of deposition region of a substrate. The phrase“deposition region” generally refers to a region where an organicmaterial layer is being coated on a substrate. Slot die coating assembly2800 can be in flow communication with a coating solution supply system(not shown) which provides a coating solution to slot die coatingassembly 2800. As shown in an expanded view of FIG. 2B, coatingapparatus 2000 can have a substrate, such as substrate 2050, which canbe supported by a substrate support apparatus, such as a chuck, forexample, but not limited by, a vacuum chuck, a substrate floatationchuck having pressure ports, and a substrate floatation chuck havingvacuum and pressure ports. According to various embodiments of thepresent teachings, a support apparatus can be for example, but notlimited by, a substrate floatation table having pressure ports, and asubstrate floatation table having vacuum and pressure ports. Variousembodiments of a chuck and a floatation table can be configured using aporous media to establish a uniform distributed vacuum, pressure orcombination of vacuum and pressure. Various porous media used toconfigure a chuck or a floatation table of the present teachings caninclude a porous material such as a carbon or ceramic material, sinteredglass, or some other material such as can include a pore size of lessthan 1 micrometer or even less than 0.5 micrometers in diameter. Such asmall pore size can ensure the uniform distribution of vacuum, pressure,as well as the combination of vacuum and pressure that can be used tosupport a substrate.

In an illustrative example, the uniform height, or fly height, in apressure-vacuum zone in comparison with a pressure only zone can besubstantially different. The fly height of a substrate over a substratesupport apparatus utilizing pressure and vacuum can be held at a preciseZ-axis fly height over the entire area of a substrate, given theformation of a bidirectional fluid spring that can be formed using thecombination of pressure and vacuum. A fly height of a substrate over apressure-only zone may produce more variation of fly height over thearea of a substrate than the precision of the fly height over theentirety of a substrate over a pressure-vacuum zone, due to the absenceof vacuum preload in a pressure only zone. With respect to fly height,in an illustrative example, a substrate can have a fly height of betweenabout 150 micrometers (μ) to about 300μ, above pressure-only zones, andthen between about 30μ to about 50μ above a pressure-vacuum zone.

Substrate floatation table 2200 of FIG. 2B, in conjunction with a Y-axismotion system, can be part of a substrate conveyance system providingfor the frictionless conveyance of substrate 2050. A Y-axis motionsystem of the present teachings can include first Y-axis track 2351 andsecond Y-axis track 2352, which can include a gripper system (not shown)for holding a substrate. Y-axis motion can be provided be either alinear air bearing or linear mechanical system. Substrate floatationtable 2200 of coating apparatus 2000 shown in FIG. 2A and FIG. 2B candefine the travel of substrate 2050 through enclosure assembly 1000 ofFIG. 1 during a coating process.

With respect to FIG. 2B, coating apparatus base 2100, can include firstriser 2120 and second riser 2122, upon which bridge 2130 is mounted.Additionally, first isolator set 2110 (second not shown on opposingside) and second isolator set 2112 (second not shown on opposing side)support substrate floatation table 2200 of coating apparatus 2000. Forvarious embodiments of coating apparatus 2000, bridge 2130 can supportfirst X-axis carriage assembly 2301 and second X-axis carriage assembly2302, which can control the movement of various devices and assembliesthat can be mounted on the X-axis carriages. For example, a Z-axismoving plate can be mounted to an X-axis carriage. In variousembodiments of a coating apparatus of the present teachings, a coatingassembly can be mounted to one or both of a Z-axis moving plate. Invarious embodiments of a coating apparatus of the present teachings, acoating assembly can be mounted to one of an X-axis carriage, and aninspection assembly can be mounted to the other X-axis carriage. Forvarious embodiments of coating apparatus 2000, first X-axis carriageassembly 2301 and second X-axis carriage assembly 2302 can utilize alinear air bearing motion system, which are intrinsically low-particlegenerating. According to various embodiments of a coating system of thepresent teachings, an X-axis carriage can have a Z-axis moving platemounted thereupon. In FIG. 2B, first X-axis carriage assembly 2301 isdepicted with first Z-axis moving plate 2310, while second X-axiscarriage assembly 2302 is depicted with second Z-axis moving plate 2312.

According to various embodiments of a coating system of the presentteachings, given the continuous use of an automated industrial coatingsystem, first maintenance system 2701 and second maintenance system 2702can be housed in an auxiliary enclosure, which can be isolated from acoating system enclosure during a coating process for performing variousmaintenance tasks with little or no interruption to a coating process.As can be seen in FIG. 2B, maintenance modules 2707, 2709 and 2711 canbe positioned proximal a coating apparatus, but as can be seen in FIG.2A, positioned within an auxiliary enclosure, such as auxiliaryenclosure 1330′ and 1370′ of FIG. 2A. Apparatuses 2707, 2709, and 2011can be any of a variety of subsystems or modules for performing variousmaintenance functions. For example apparatuses 2707, 2709, and 2011 canbe any of a module for storing or receiving a part for a system repairoperation.

In the expanded view of coating apparatus 2000 of FIG. 2B, variousembodiments of a coating system can include substrate floatation table2200, supported by substrate floatation table base 2220. Substratefloatation table base 2220 can be mounted on coating apparatus base2100. Substrate floatation table 2200 of enclosed coating system cansupport substrate 2050, as well as defining the travel over whichsubstrate 2050 can be moved through enclosure assembly 1000 during thecoating of an OLED substrate. A Y-axis motion system of the presentteachings can include first Y-axis track 2351 and second Y-axis track2352, which can include a gripper system (not shown) for holding asubstrate. Y-axis motion can be provided by either a linear air bearingor linear mechanical system. In that regard, in conjunction with amotion system; as depicted in FIG. 2B, such as a Y-axis motion system,substrate floatation table 2200 can provide frictionless conveyance ofsubstrate 2050 through a coating system.

FIG. 2C depicts an expanded perspective cut-away view of first side 2801of various embodiments of slot die coating assembly 2800 of FIG. 2B. Aplurality of positioning sensors, such as position sensor 2820, can beoperably connected to slot die coating assembly 2800, so that theposition of slot die coating assembly 2800 relative to substrate 2050 ofFIG. 2B can be continuously determined. As will be discussed in moredetail subsequently herein, positioning can additionally be providedusing various embodiments of a camera assembly. Positioning sensor 2820can be, for example, a laser-based positioning system. Slot die assembly2800 can include slot die 2805, having first lip 2812 and second lip2814, between which slot die gap outlet 2814 is depicted. During acoating process, slot die 2805 is in flow communication with a coatingsolution, so that slot die gap outlet 2814 is at a predetermineddistance from substrate 2050 of FIG. 2B. A coating solution flows fromslot die gap outlet 2814 as substrate 2050 moves relative to coatingassembly 2800 or FIG. 2B, forming a coating of fixed position, width andthickness on substrate 2050. Extremely flat and straight die surfaces,in conjunction with precise positioning of the die with respect to thesubstrate can provide patterned slot die coating in which film thicknessuniformity of about 1% to about 3% of a target film thickness. In orderto achieve good coating uniformity of films formed over a depositionregion of a substrate, for patterned slot die coating, accurate andrepeatable timing of the position of the die with a substrate, as wellas proper timing of coating fluid flow start and stop with die movement,can be done to ensure that there will be no build-up at the leadingedge, and that the trailing edge of an area of a substrate coated isuniformly straight and thick.

FIG. 2D schematically depicts a patterned coating of a substrate using acoating apparatus, such as described herein for coating apparatus 2000of FIG. 2B. Shown in FIG. 2D is an array of patterned coating areas ordeposition regions, such as patterned coating area or deposition region50, on substrate 2050, using a slot die coating assembly, such as slotdie coating assembly 2800 of FIG. 2B and FIG. 2C. The phrase “depositionregion” generally refers to a region where an organic material layer isbeing coated on a substrate. According to the present teachings, variousembodiments of a coating apparatus can provide patterned coating on asubstrate that provide a coating film thickness of about 20 nm(nanometers) to about 150μ (microns) for a film coated over a depositionregion of a substrate, with a film uniformity as previously stated ofabout 1% to about 3% of a target film thickness with coating accuracy ofbetween about +/−100μ (microns) or less. According to the presentteachings, various embodiments of a coating apparatus can providepatterned coating on a substrate that provide high substrate yields andeffective material usage with low waste. Additionally, variousformulations used for patterned coating with various embodiments of anenclosed coating apparatus of the present teachings can have a widerange of physical properties, such as viscosity and surface tension.

FIG. 3A illustrates generally an isometric view and FIG. 3B illustratesgenerally a plan view of at least a portion of an enclosed andenvironmentally controlled coating system 3000, such as including afirst coating module 3500A, a second coating module 3500B, and othermodules, that can be used in manufacturing various devices for example,but not limited by, OLED displays, OLED lighting, organic photovoltaics,Perovskite solar cells, and organic semiconductor circuits. In themanufacture of such devices, patterned coating can be done as part ofthe manufacturing process.

The an enclosed and environmentally controlled coating system 3000 caninclude a first coating module 3500A, that can include a coatingapparatus, such as coating apparatus 2000 described in relation to otherexamples herein. In order to provide one or more of increasedthroughput, redundancy, or multiple processing operations, other coatingsystems can be included, such as a second coating module 3500B, whichcan also include a coating apparatus, such as coating apparatus 2000 aspreviously described herein. The system enclosed coating system 3000 canalso include one or more other modules, such as first processing module3200A or a second processing module 3200B.

According to the present teachings, first or second processing modules3200A or 3200B can be used for one or more of holding a substrate (e.g.,to facilitate flowing or dispersing the deposited material layer, suchas to achieve a more planar or uniform film) or curing (e.g. via lightillumination, such as illumination using UV radiation) a layer ofmaterial, such as deposited by one or more of the first or secondcoating modules 3500A or 3500B. For example, for a material layer thatis coated on a substrate, or is cured, using the first or secondprocessing modules 3200A or 3200B can include a portion of anencapsulation layer (such as a thin film layer comprising an organicencapsulant cured or treated via exposure to ultraviolet light). Thefirst or second processing modules 3200A or 3200B can be configured forholding substrates as described above, such as in a stackedconfiguration. Processing module 3200B could alternatively (oradditionally) be configured for vacuum drying one or more substrates,such as in a stacked configuration. In the case that one or more of thefirst or second processing modules 3200A or 3200B function as a vacuumdrying module for more than one substrate at a time, the stackedconfiguration can include multiple drying slots in a single chamber or astack of isolated chambers, each having a single drying slot. In yetanother configuration, one or more of the first or second processingmodules 3200A or 3200B can be configured for holding substrates andanother processing module can be provided attached to a transfer module3400 for vacuum drying one or more substrates. The first and secondcoating modules 3500A and 3500B can be used, for example, for depositingthe same layers on a substrate or coating modules 3500A and 3500B can beused for depositing different layers on a substrate.

The enclosed coating system 3000 can include an input or output module3100 (e.g., a “loading module”), such as can be used as a load-lock orotherwise in a manner that allows transfer of a substrate 2050 into orout of an interior of one or more chambers of the enclosed coatingsystem 3000 in a manner that substantially avoids disruption of acontrolled environment maintained within one or more enclosures of theenclosed coating system 3000. For example, in relation to FIG. 3A,“substantially avoids disruption” can refer to avoiding raising aconcentration of a reactive species by a specified amount, such asavoiding raising such a species by more than 10 parts per million, 100parts per million, or 1000 parts per million within the one or moreenclosures during or after a transfer operation of a substrate 2050 intoor out the one or more enclosures. A transfer module 3400, such as caninclude a handler 3410, can be used to manipulate the substrate 2050before, during, or after various operations. One or more additionalhandlers can be included, such as to provide a substrate to the input oroutput module 3100 or receive a substrate from the input or outputmodule 3100. Enclosed coating system 3000 can include an additionalinput or output module, for example, on the right side of transfermodule 3400 clearly shown in FIG. 3A and FIG. 3B, opposite the side oftransfer module 3400 that input or output module 3100 is shown in FIG.3A and FIG. 3B.

FIG. 4 illustrates generally, a technique, such as a method, that caninclude forming an organic thin-film layer on a deposition region of anelectronic device (e.g. OLED displays, OLED lighting, organicphotovoltaics, Perovskite solar cells, and organic semiconductorcircuits.). In the example 4000 of FIG. 4, at 4100, a substrate can bereceived in a transfer chamber, such as transfer module 3400 of FIG. 3Aand FIG. 3B, as shown and described in relation to other examplesherein. A substrate can be from an environment different from acontrolled environment of the transfer module, such as using a loadingmodule (e.g., “load lock”), such as loading module 3100 of FIG. 3A andFIG. 3B. At 4200, a substrate can be transferred to an enclosed coatingmodule, such as at least in part using a handler robot, such as handlerrobot 3410 located within transfer module 3400 of FIG. 3A and FIG. 3B.Alternatively, a handler robot can be housed within the enclosed coatingmodule. At 4300, a substrate can be uniformly supported in a coatingmodule, such as using techniques and apparatuses to reduce or inhibitformation of visible defects during coating operations or otheroperations.

For example, such substrate support can include a chuck (e.g., a planarchuck or tray) or a floatation table such as configured to provideuniform physical contact in areas of the substrate upon or oppositeregions of the substrate where active electronic devices have beenformed. This, however, can present a variety of challenges because, forexample, various substrate support apparatuses generally provide holesin central regions of the substrate through which lift pins can raiseand lower the substrate, so as to facilitate loading and unloadingoperations. These holes can represent regions of non-uniform physicalcontact with a substrate. In the example of a vacuum chuck, there canalso be grooves or holes through which the vacuum suction is providedthat holds a substrate in place, and generally some of such groove orhole features are located in the central region of a substrate toachieve desired hold-down performance.

The present inventors have recognized, among other things, that asubstrate support apparatus, such as a chuck or floatation table (orother portion of the system supporting the substrate), can be configuredso as to position substrate support apparatus features to minimize oreliminate their impact on a target coating pattern. In an example, asubstrate support apparatus, such as a chuck or a floatation table, canfurther provide non-uniform physical contact to certain areas of thesubstrate upon or opposite regions of the substrate outside where activeelectronic devices have been formed. The present inventors have alsorecognized that uniform support of a substrate can be addressed by usinga chuck having a distributed vacuum region instead of individual vacuumgrooves or holes, such as a continuous porous medium through whichvacuum suction is provided. Remaining holes in the chuck associated withthe lift pins can be located at one or more of a periphery of asubstrate or a periphery of active regions (including regions opposite asurface defining a periphery of a substrate or a periphery of activeregions of the substrate). In these examples, the same support structureconfigurations can be applied to any active electronic, optical, oroptoelectronic devices, wherein the active region can represent a regionwithin which the devices being coated are located.

Alternatively, for example, the present inventors have also recognized,among other things, that a substrate can be uniformly supported by achuck or floatation table at least in part using a gas cushion, such asduring one or more of a coating operation or other processing such asbefore or during ultraviolet treatment in a curing module. Use of such agas cushion can enhance uniformity of a coated organic material ortreated organic film layer on a substrate. For example, by floating asubstrate above a physical substrate support surface, a substrate isuniformly supported by a gas in all of regions and is relatively lesssensitive to the presence of holes for lift pins, lift pins, or otherlocalized features that may be present on physical substrate supportsurface. In such a floating support example, lift pins in the centerregion of a substrate can be incorporated into the support mechanismwithout affecting film uniformity in those areas because a substrate isnot in physical contact with extended or retracted lift pins and issupported by a gas cushion in the center region during processing suchas coating, holding, or curing. In addition, or instead, a substrate canbe further uniformly supported or retained by physical contactrestricted to regions outside such active regions, such as in one ormore of a substrate periphery or a periphery between active regions. Inthis way, all of a substrate area can offer a highly uniform coating andcan be used productively, except, potentially, for an exclusion zone atthe substrate edge where the substrate is physically contacted so as toconstraint or hold it in place in the floatation plane.

At 4400, an organic material formulation can be coated in a targetdeposition region of a substrate, such as including a polymer componentto form a uniform organic material untreated layer. The phrase“deposition region” generally refers to the region where an organicmaterial layer is being coated on a substrate. At 4500, a substrate canbe transferred from a coating module to a transfer module. At 4600, asubstrate can be transferred from a transfer module to a curing module.A curing module can be configured to treat the coated organic materialat 4700, such as to provide a uniform organic film layer. For example,the curing module can be configured to provide optical treatment, suchas an ultraviolet light treatment, to a coated organic materialformulation layer to polymerize or otherwise cure an organic materialcoated on a deposition region of a substrate to form an organic filmlayer.

Various embodiments of coating systems can have additional apparatusesand subassemblies for providing additional features to various coatingsystems of the present teachings. As previously discussed herein,regarding motion systems supporting various carriage assemblies of thepresent teachings, coating apparatus 2000 of FIG. 2A can have a firstX-axis carriage that can be used for mounting a coating assembly and asecond carriage assembly that can be used to mount a variety of variousassemblies, such as an inspection assembly that can include a cameraassembly. For example, a substrate inspection assembly including acamera assembly can be mounted on a Z-axis moving plate of a X-axiscarriage, to provide precision X,Z positioning of an inspection assemblywith respect to a substrate positioned on a substrate support, such asfloatation table 2220 of FIG. 2B. A camera assembly can be any imagesensor device that converts an optical image into an electronic signal,such as by way of non-limiting example, a charge-coupled device (CCD), acomplementary metal-oxide-semiconductor (CMOS) device or N-typemetal-oxide-semiconductor (NMOS) device. Various image sensor devicescan be configured as an array of sensors for an area scan camera, or asingle row of sensors, for a line scan camera. A camera assembly can beconnected to image processing system that can include, for example, acomputer for storing, processing, and providing results

Moreover, precision XYZ motion of a camera relative to a substrate canbe done for either area scanning or line scanning processes. Aspreviously discussed herein, other motion systems, such as a gantrymotion system, can also be used to provide precision movement in threedimensions between, for example, a coating assembly and/or a cameraassembly, relative to a substrate. Additionally, lighting can be mountedin various positions; either on an X-axis motion system or on asubstrate support apparatus proximal to a substrate, and combinationsthereof. In that regard, lighting can be positioned according toperforming various lightfield and darkfield analyses, and combinationsthereof. Various embodiments of a motion system can position a cameraassembly relative to a substrate using a continuous or a stepped motionor a combination thereof to capture a series of one or more images ofthe surface of a substrate. For example, with respect to verifyingparticle control, during the coating of an encapsulation layer on anactive area of a various OLED-based devices and apparatuses, images ofparticles can be obtained using image processing, and size and number ofparticles of a specific size can be determined. In various embodimentsof systems and methods of the present teachings, a line scan camerahaving about 8192 pixels, with a working height of about 190 mm, andcapable of scanning at about 34 kHz can be used.

Additionally, more than one camera can be mounted on an X-axis carriageassembly for various embodiments of a coating system substrate cameraassembly, where each camera can have different specifications regardingfield of view and resolution. For example, one camera can be a line scancamera for in situ particle inspection, while a second camera can be forregular navigation of a substrate in an enclosed coating system. Such acamera useful for regular navigation can be an area scan camera having afield of view in the range of about 5.4 mm×4 mm with a magnification ofabout 0.9× to about 10.6 mm×8 mm with a magnification of about 0.45λ. Instill other embodiments, one camera can be a line scan camera for insitu particle inspection, while a second camera can be for precisenavigation of a substrate in an enclosed coating system, for example,for substrate alignment. Such a camera can be useful for precisenavigation can be an area scan camera having a field of view of about0.7 mm×0.5 mm with a magnification of about 7.2×.

FIG. 5 is a schematic diagram showing enclosed coating system 500.Various embodiments of enclosed coating system 500 according to thepresent teachings can comprise enclosure assembly 100 for housing acoating system, gas purification loop 130 in fluid communicationenclosure assembly 100, and at least one thermal regulation system 140.Additionally, various embodiments of enclosed coating system 500 canhave pressurized inert gas recirculation system 300, which can supplyinert gas for operating various devices, such as a substrate floatationtable for an enclosed coating system. Various embodiments of apressurized inert gas recirculation system 300 can utilize a compressor,a blower and combinations of the two as sources for various embodimentsof pressurized inert gas recirculation system 300. Additionally,enclosed coating system 500 can have a circulation and filtration systeminternal to enclosed coating system 500 (not shown).

Enclosed coating system 500 of FIG. 5 can have a first enclosure with afirst enclosure volume and a second enclosure with a second enclosurevolume, such as shown, for example in FIG. 1. For enclosed coatingsystem 500, if all valves, V₁, V₂, V₃ and V₄ are opened, then gaspurification loop 130 operates to purify both first enclosure volume100-S1 and second enclosure volume 100-S2. With closure of V₃ and V₄,only first enclosure volume 100-S1 is in fluid communication with gaspurification loop 130. This valve state may be used, for example, butnot limited by, when second enclosure volume 100-S2 is sealably closedand isolated from first enclosure volume 100-S1 during a maintenanceprocedure requiring that second enclosure volume 100-S2 be opened to theatmosphere. With closure of V₁ and V₂, only second enclosure volume100-S2 is in fluid communication with gas purification loop 130. Thisvalve state may be used, for example, but not limited by, duringrecovery of second enclosure volume 100-S2 after the second enclosurehas been opened to the atmosphere. As the requirements for gaspurification loop 130 are specified with respect to the total volume ofenclosed coating system 500, by devoting the resources of a gaspurification system to the recovery of a second enclosure volume 100-S2,which is substantially less than the volume of first enclosure volume100-S1, the recovery time or enclosed coating system 500 can besubstantially reduced.

As depicted in FIG. 5, for various embodiments of an enclosed coatingsystem according to the present teachings, the design of a circulationand filtration system can separate the inert gas circulated through gaspurification loop 130 from the inert gas that is continuously filteredand circulated internally for various embodiments of an enclosed coatingsystem. Gas purification loop 130 includes outlet line 131 fromenclosure assembly 100, to a solvent removal system 132 and then to gaspurification system 134. Inert gas purified of solvent and otherreactive gas species, such as oxygen, ozone, and water vapor, are thenreturned to enclosure assembly 100 through inlet line 133. Gaspurification loop 130 may also include appropriate conduits andconnections, and sensors, for example, oxygen, ozone, water vapor andsolvent vapor sensors. A gas circulating unit, such as a fan, blower ormotor and the like, can be separately provided or integrated, forexample, in gas purification system 134, to circulate gas through gaspurification loop 130. According to various embodiments of an enclosedcoating system, though solvent removal system 132 and gas purificationsystem 134 are shown as separate units in the schematic shown in FIG. 5,solvent removal system 132 and gas purification system 134 can be housedtogether as a single purification unit.

Gas purification loop 130 of FIG. 5 can have solvent removal system 132placed upstream of gas purification system 134, so that inert gascirculated from enclosure assembly 100 passes through solvent removalsystem 132 via outlet line 131. According to various embodiments,solvent removal system 132 may be a solvent trapping system based onadsorbing solvent vapor from an inert gas passing through solventremoval system 132 of FIG. 5. A bed or beds of a sorbent, for example,but not limited by, such as activated charcoal, molecular sieves, andthe like, may effectively remove a wide variety of organic solventvapors. For various embodiments of an enclosed coating system cold traptechnology may be employed to remove solvent vapors in solvent removalsystem 132. As previously discussed herein, for various embodiments ofan enclosed coating system according to the present teachings, sensors,such as oxygen, ozone, water vapor and solvent vapor sensors, may beused to monitor the effective removal of such species from inert gascontinuously circulating through an enclosed coating system, such asenclosed coating system 500 of FIG. 5. Various embodiments of a solventremoval system can indicate when sorbent, such as activated carbon,molecular sieves, and the like, has reached capacity, so that the bed orbeds of sorbent can be regenerated or replaced. Regeneration of amolecular sieve can involve heating the molecular sieve, contacting themolecular sieve with a forming gas, a combination thereof, and the like.Molecular sieves configured to trap various species, including oxygen,ozone, water vapor, and solvents, can be regenerated by heating andexposure to a forming gas that comprises hydrogen, for example, aforming gas comprising about 96% nitrogen and 4% hydrogen, with saidpercentages being by volume or by weight. Physical regeneration ofactivated charcoal can be done using a similar procedure of heatingunder an inert environment.

Any suitable gas purification system can be used for gas purificationsystem 134 of gas purification loop 130 of FIG. 5. Gas purificationsystems available, for example, from MBRAUN Inc., of Statham, N.H., orInnovative Technology of Amesbury, Mass., may be useful for integrationinto various embodiments of an enclosed coating system according to thepresent teachings. Gas purification system 134 can be used to purify oneor more inert gases in enclosed coating system 500, for example, topurify the entire gas atmosphere within an enclosed coating system. Aspreviously discussed herein, in order to circulate gas through gaspurification loop 130, gas purification system 134 can have a gascirculating unit, such as a fan, blower or motor, and the like. In thatregard, a gas purification system can be selected depending on thevolume of the enclosure, which can define a volumetric flow rate formoving an inert gas through a gas purification system. For variousembodiments of an enclosed coating system with a volume of up to about 4m³; a gas purification system that can move about 84 m³/h can be used.For various embodiments of an enclosed coating system with a volume ofup to about 10 m³; a gas purification system that can move about 155m³/h can be used. For various embodiments of an enclosed coating systemhaving a volume of between about 52-114 m³, more than one gaspurification system may be used.

Any suitable gas filters or purifying devices can be included in the gaspurification system 134 of the present teachings. In some embodiments, agas purification system can comprise two parallel purifying devices,such that one of the devices can be taken off line for maintenance andthe other device can be used to continue system operation withoutinterruption. In some embodiments, for example, the gas purificationsystem can comprise one or more molecular sieves. In some embodiments,the gas purification system can comprise at least a first molecularsieve, and a second molecular sieve, such that, when one of themolecular sieves becomes saturated with impurities, or otherwise isdeemed not to be operating efficiently enough, the system can switch tothe other molecular sieve while regenerating the saturated ornon-efficient molecular sieve. A control unit can be provided fordetermining the operational efficiency of each molecular sieve, forswitching between operation of different molecular sieves, forregenerating one or more molecular sieves, or for a combination thereof.As previously discussed herein, molecular sieves may be regenerated andreused.

Thermal regulation system 140 of FIG. 5 can include at least one chiller142, which can have fluid outlet line 141 for circulating a coolant intoan enclosed coating system, and fluid inlet line 143 for returning thecoolant to the chiller. An at least one fluid chiller 142 can beprovided for cooling the gas atmosphere within enclosed coating system500. For various embodiments of an enclosed coating system of thepresent teachings, fluid chiller 142 delivers cooled fluid to heatexchangers within the enclosure, where inert gas is passed over afiltration system internal the enclosure. At least one fluid chiller canalso be provided with enclosed coating system 500 to cool heat evolvingfrom an apparatus enclosed within enclosed coating system 500. Forexample, but not limited by, at least one fluid chiller can also beprovided for enclosed coating system 500 to cool heat evolving from anenclosed coating system. Thermal regulation system 140 can compriseheat-exchange or Peltier devices and can have various coolingcapacities. For example, for various embodiments of an enclosed coatingsystem, a chiller can provide a cooling capacity of from between about 2kW to about 20 kW. Various embodiments of an enclosed coating system canhave a plurality of fluid chillers that can chill one or more fluids. Insome embodiments, the fluid chillers can utilize a number of fluids ascoolant, for example, but not limited by, water, anti-freeze, arefrigerant, and a combination thereof as a heat exchange fluid.Appropriate leak-free, locking connections can be used in connecting theassociated conduits and system components.

While embodiments of the present disclosure have been shown anddescribed herein, it will be obvious to those skilled in the art thatsuch embodiments are provided by way of example only. Embodiments of anenclosed coating system according to the present teachings can be usefulfor patterned area coating of substrates in the manufacture of a varietyof apparatuses and devices in a wide range of technology areas, forexample, but not limited by, OLED displays, OLED lighting, organicphotovoltaics, Perovskite solar cells, and organic semiconductorcircuits. Numerous variations, changes, and substitutions will now occurto those skilled in the art without departing from the disclosure. It isintended that the following claims define the scope of the disclosureand that methods and structures within the scope of these claims andtheir equivalents be covered thereby.

What is claimed is:
 1. A system comprising: a gas enclosure defining aninterior to maintain a controlled environment; a coating system housedwithin the interior of the gas enclosure, the coating system comprising:a slot die coating assembly; a substrate support system to support asubstrate to be coated; and a motion system configured to position thesubstrate and the slot die coating assembly relative to one another; agas circulation and filtration system in flow communication with theinterior of the gas enclosure; and a gas purification system in flowcommunication with the interior of the gas enclosure.
 2. The system ofclaim 1, wherein the slot die coating assembly is configured to deposita material in a pattern on the substrate.
 3. The system of claim 1,wherein the controlled environment is an inert gas environment.
 4. Thesystem of claim 3, wherein the inert gas selected from nitrogen, any ofthe noble gases, and combinations thereof.
 5. The system of claim 1,wherein the gas purification system is configured to maintain a reactivespecies in the interior at 100 ppm or less.
 6. The system of claim 1,wherein the reactive species is selected from at least one of watervapor, oxygen, ozone, and organic solvent vapor.
 7. The system of claim1, wherein the substrate support system comprises a floatation table. 8.The system of claim 1, wherein the gas circulation and filtration systemis configured to provide a substantially laminar flow of gas through theinterior.
 9. The system of claim 1, wherein the volume of the gasenclosure ranges from about 6 m³ to about 95 m³.
 10. The system of claim1, further comprising a position sensor arranged to determine a positionof the slot die coating assembly relative to the substrate.
 11. Thesystem of claim 1, wherein the slot die coating assembly furthercomprises a slot die having a slot die outlet to flow a coating materialto be deposited on the substrate.
 12. The system of claim 13, whereinthe slot die outlet is configured to be placed in flow communicationwith a coating material supply.
 13. The system of claim 1, wherein themotion system comprises: a Y-axis motion system to convey the substratealong the substrate support system in a Y-axis direction; and an X-axiscarriage assembly to move the slot die coating assembly along an X-axisdirection.
 14. The system of claim 13, further comprising a linear airbearing system operably coupled to the X-axis carriage assembly.
 15. Thesystem of claim 13, further comprising a Z-axis moving plate mounted tothe X-axis carriage assembly, wherein the slot die coating assembly ismounted to the Z-axis moving plate.
 16. The system of claim 1, furthercomprising an auxiliary enclosure housing a maintenance system, whereinthe auxiliary enclosure defines an interior to maintain a controlledenvironment.
 17. The system of claim 16, wherein: the gas enclosurecomprises the auxiliary enclosure and a coating system enclosure housingthe coating apparatus, and the coating system enclosure and theauxiliary enclosure are configured to be selectively placed in flowcommunication with each other or isolated from each other.
 18. Thesystem of claim 16, wherein the maintenance system comprises one or moremaintenance modules to store or receive a part for maintaining thecoating apparatus.
 19. The system of claim 1, wherein the gaspurification system comprises one or more molecular sieves.
 20. Thesystem of claim 1, further comprising an auxiliary enclosure housing anoptical curing system.